G09600 - SEMI G96 - Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending Revision:SEMI G96-1014 - Superseded This Classification includes the following:

This Classification includes the following:

All such standards have since been revised to use the IOC-88 calibration factor1

This Standard presents recommendations for content and usability of documentation provided by the equipment supplier to the equipment purchaser for acquisition and use of semiconductor

automation equipment

G09600 - SEMI G96 - Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending Revision:SEMI G96-1014 - Superseded This Classification includes the following:* This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version. 1